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Denmark
Company

Tpack A/S

Industry

Communications, infrastructure & security

Description

Tpack develops and sells silicon ICs providing core data transport and switching functions to Tier 1 telecom and networking equipment suppliers. Tpacks’s SOFTSILICON products support the fastest deployment of new Carrier Ethernet and Carrier Class Packet & Optical Network standards, providing the most flexible and cost effective implementation throughout the life of the equipment.

CEO

Colin Macnab

Chairman

Hassa Parsa

Domicile

Main office:
Hoerkaer 12A
DK-2730 Herlev, Denmark

Representation office:
200 Page Mill Road, Suite 100
Palo Alto, CA-94306, USA

Website

www.tpack.com

Fund

Slotsbacken Fund II

Year of first investment

2002

Investment responsible

Thor Birkmand